SanDisk Corporation Senior Engineer, Packaging Engineering in Penang, Malaysia
General Description: Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of semiconductors. Reviews product requirements with design staff to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new or improved processes in photomasking, diffusion, deposition, wafer fabrication, and device physics. Skills/Experience: Requires BS/BA degree or equivalent with 5 or more years of related experience. The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment. Self-motivated and self-directed, however, must have demonstrated ability to work well with people. A proven desire to work as a team member, both on the same team and outside of the team. Ability to troubleshoot and analyze complex problems. Ability to multi-task and meet deadlines. Excellent communication (written and verbal) and interpersonal skills.
SanDisk offers a highly competitive compensation package and great benefits. SanDisk provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, creed, gender, national origin, age, disability, marital or veteran status, sexual orientation, gender identity or expression, or any other legally protected status.