SanDisk Corporation Staff Engineer, Packaging Engineering in Penang, Malaysia
Must have experience and knowledge in semiconductor assembly process characterization & process capability.
Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why, 5M+1E etc.).
Poses 6-Sigma knowledge will be added advantage.
Design cost effective DOE matrix, execute & analyze using equivalent statistical analysis software.
Ability to perform robust optimization
Basic understanding of package level testing & reliability.
Hands on skill with machine & tool setup will be preferred
A proven desire to work as a team member, both on the same team and outside of the team.
Ability to troubleshoot and analyze complex problems.
Ability to multi-task and meet deadlines.
Excellent English communication (written and verbal) and interpersonal skills.
Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
Accept flexible working time.
Western Digital, HGST, and SanDisk offers a highly competitive compensation package and great benefits. The company provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, creed, gender, national origin, age, disability, marital or veteran status, sexual orientation, gender identity or expression, or any other legally protected status.